December 18, 2024
The electronics industry is approaching a limit to the number of transistors that can be packed onto the surface of a computer chip. So, chip manufacturers are looking to build up rather than out.
Instead of squeezing ever-smaller transistors onto a single surface, the industry is aiming to stack multiple surfaces of transistors and semiconducting elements — akin to turning a ranch house into a high-rise. Such multilayered chips could handle exponentially more data and carry out many more complex functions than today’s electronics.
Complete article from MIT News.
Explore
MIT Engineers Advance Toward a Fault-tolerant Quantum Computer
Adam Zewe | MIT News
Researchers achieved a type of coupling between artificial atoms and photons that could enable readout and processing of quantum information in a few nanoseconds.
New Chip Tests Cooling Solutions for Stacked Microelectronics
Kylie Foy | MIT Lincoln Laboratory
Preventing 3D integrated circuits from overheating is key to enabling their widespread use.
Energy-Efficient and Environmentally Sustainable Computing Systems Leveraging Three-Dimensional Integrated Circuits
Wednesday, May 14, 2025 | 12:00 - 1:00pm ET
Hybrid
Zoom & MIT Campus