Blurred macro image of a row of green microchips.

NSF announces nearly $50 million partnership with Ericsson, IBM, Intel, and Samsung to support the future of semiconductor design and manufacturing

NSF | Directorate for Technology, Innovation and Partnerships

The U.S. National Science Foundation announces a cross-sector partnership with Ericsson, IBM, Intel, and Samsung to support the design of the next generation of semiconductors as part of its Future of Semiconductors (FuSe) initiative.

technology and ethics symbols overlaying a world map and hand pointing to ethics symbol all in shades of blue

Social and Ethical Responsibilities of Computing (SERC) Symposium

Tuesday, April 18, 2023 | 8:00am - 5:30pm ET

MIT Media Lab, 6th Floor

Artificial Intelligence brain shape in a complex and modern GPU card in shades of purple, blue, and gold

MIT AI Hardware Program Annual Symposium

Thursday, April 6, 2023 | 9:30am - 2:30pm ET
MIT Building 34, Room 401, Grier Room

Multiple Speakers

Abstract Artificial intelligence brain and neural architecture in shades of blue, yellow, and red with shadowy background

2023 MIT AI and Autonomy Conference

Wednesday, April 5, 2023 | 8:00am - 6:30pm ET
In-person

Multiple Speakers

rainbow of colors in an abstract ferroelectric magnetic field

Ferroelectric Memories at Last

Wednesday, March 15, 2023 | 1:00 - 2:00pm ET

Speaker: Beatriz Noheda

Inside of the digital electronic computer of processor chip on computer mainboard.

The Future of Semiconductor Manufacturing

Friday, March 17, 2023 | 3:00 - 4:00pm ET,
MIT Building E51-115, Wong Auditorium, Tang Center

Speaker: Pat Gelsinger, Intel

A macro shot of a circuit board in shades of green and yellow with a shallow depth of field

Nano Explorations: Delocalized Photonic Deep Learning on the Internet’s Edge

Monday, March 7, 2023 | 11:00am - 11:45am ET

Speaker: Alex Sludds, MIT PhD Candidate

Rendering shows a unique thermometer with various transparent tubes snaking out. Purple energy flows and connects two sides of the thermometer, and the temperature is hot.

New Quantum Computing Architecture Could be Used to Connect Large-scale Devices

Adam Zewe | MIT News Office

Researchers have demonstrated directional photon emission, the first step toward extensible quantum interconnects.

computer chip in strong magenta blue and purple lighting

Accelerating AI through Photonic Computing and Communication

Wednesday, February 22, 2023 | 12:00pm - 1:00pm ET
MIT Building 36, Room 4462, Allen Room

Speaker: Darius Bunandar, Lightmatter

abstract topography with rows of data points in shades of blue and grey

Advances in Additive Manufacturing

Thursday, February 16, 2023 | 10:00am - 12:00pm ET

Multiple Speakers