New System Designs Nanomaterials that Conduct Heat in Specific Ways
Adam Zewe | MIT News Office
The technique could be used to fabricate computer chips that won’t get too hot while operating, or materials that can convert waste heat to energy.
Fall MTL Mini Technical Symposium
Wednesday, November 16, 2022 | 9:00am - 12:00pm ET
Multiple Speakers
IIoT, Industry 4.0, and Industrial Machine Learning: a 25 Year Retrospective, Current Lessons-learned, and Future Trajectories
Wednesday, October 5, 2022 | 12:00 - 1:00pm ET, RLE Room 36-462
Speaker: Vivek Dave, Harting Innovation Hub
The Domestic Chip Manufacturing Industry
Ann Fisher | NPR All Sides Podcast
Prof. Jesús del Alamo speaks with Ann Fisher of WOSU’s All Sides with Ann Fisher about the importance of supporting domestic chip manufacturing in the U.S.
Physicists Discover a “family” of Robust, Superconducting Graphene Structures
Jennifer Chu | MIT News Office
MIT physicists have established twisted graphene as a new “family” of robust superconductors, each member consisting of alternating graphene layers, stacked at precise angles. The findings could inform the design of practical superconducting devices.
MTL Mini Technical Symposium
Saturday, July 20, 2022 | 9:00am - 12:15pm ET
Multiple Speakers
Quantum Sensor Can Detect Electromagnetic Signals of any Frequency
David L. Chandler | MIT News Office
MIT engineers expand the capabilities of ultrasensitive nanoscale detectors, with potential uses for quantum computing and biological sensing.
Beneq Transform—Versatile, Automated ALD Solution for High-throughput Semiconductor Production
Tuesday, June 14, 2022 | 10am – 11am ET
Speaker: Patrick Rabinzohn, Product Strategy and Business Development, Executive Semiconductor ALD, Beneq
Engineers Build LEGO-like Artificial Intelligence Chip
Jennifer Chu | MIT News Office
MIT engineers have created a reconfigurable AI chip that comprises alternating layers of sensing and processing elements that can communicate with each other.
IBM Statement Welcoming New US-Japan Partnership on Semiconductors
IBM Research
IBM Senior Vice President and Director of Research Dario Gil, welcomes a new U.S.-Japan Joint Statement that includes a bilateral partnership on semiconductors.